| Fabrication equipment
|
|
Controlled
gas ambient quartz tube furnaces: Lindberg, Thermtek
|
|
High
Vacuum Magnetron Sputterer with 4- S guns: CVC AST-601
|
|
High
Vacuum e-beam Evaporator with 4-source hearth: Temescal BJD-1800
|
|
Hydrostatic
Press: Fluitron
|
|
Photo
mask aligning & exposure: Karl Suss MJB-3
|
|
Plasma
Enhanced Chemical Vapor Deposition (PECVD): Plasmalab DP80
|
|
Reactive
Ion Etching (RIE): Plasmalab mP RIE
|
|
Resist
Spinner, microprocessor controlled: Headway Research PWM101D
|
|
Silicon
Micro-machining, Chemical Etching
|
|
Soft
and Hard-bake resist ovens: Blue M Stabil-Therm
|
|
Ultrasonic/thermo
compaction wire bonder: Hybond 572AWedge Bonder
|
|
Controlled
gas ambient quartz tube furnaces: Lindberg, Thermtek
|
| 80
Plus Compact ICP/RIE Etch System with Inductively Coupled Plasma for DRIE,
Oxford Instruments |
| Ultra
high vacuum sputtering system (Orion-8-UHV, AJA International) |
|
Characterization equipment |
|
Stylus Film Thickness Profilometer: Dektak 3030 with video capture
|
| Thin Film Measurement/high mag. optical microscope:
Lietz Ergolux/Filmetrics F40 system with video capture |
| Field Emission Scanning Electron Microscope:
Zeiss Supra55 VP with STEM & Nabity NPGS accessories |
| Thin
Film Stress Tester RT through 950C |
| Capacitance-Voltage
Profiler (with electro-chem etch) |
| Potentionstat-galvanostat,
DC & 1 mHz-100 mHz: Perkin Elmer
Parstat 2263 |
| Thin
Film Stress Tester, ambient-950 C: SMSI 8900 TC |
| Leak
Detector, Three-mass: Pfeiffer QualyTest |
| Fluorescence micscopy/chemical imaging system
ChemImage Falcon |
| Wentworth Probe Station with Video Capture |